Senior Engineer, Smart Wafer Bumping

**Remuneration Package**: - Basic Salary Up to $6,000 - AWS 1 Month - Variable Bonus (Subject to individual & company performance) **Responsibilities**: - Design, Develop and implement Manufacturing Process control involving CIM and Wafer Map system. - In charge of Wafer map conversion, validation, merging in Txt, G85, Binary format to support Production...

Overview Senior / Engineer – Yield & Process Integration. Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (Dry and Wet), including the proposal and execution of Design of Experiments (DOEs). Responsibilities...

Responsibilities Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross‐functional teams and customer Maintains documentation of customer projects starting from Kick‐off, Engineering build, Qualification and Off‐load to full production Reviews and analyses...

Deputy Director of Process Engineering -Semicon Role Overview This role leads the process engineering function for a 12" wafer bumping fabrication line, overseeing end-to-end operations from photolithography to reflow. The position focuses on yield optimization, process innovation, and technical excellence while managing a large multidisciplinary engineering...

Responsibilities Lead Equipment support team for in depth technical analysis Carry out effective planning for CM and PM (inclusive of system setup)Maintain high equipment reliability with minimal resource requirement Equipment startup, installation and maintenance Troubleshooting and provide upgrade or improvement to the equipment Analyze equipment failure...

Package Design Engineer Responsible for product and tooling design. Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged. Responsibilities Generate, update, and revise electrical routing layout based on netlist or customer design. Generate test vehicle design and related PCB design. Generate reticle and stencil design....

Package Design Engineer Responsible for product and tooling design. Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged. Responsibilities Generate, update, and revise electrical routing layout based on netlist or customer design. Generate test vehicle design and related PCB design. Generate reticle and stencil design....

Description Senior / Process Application Engineer (Wet Chemical Processing) 1 day ago Be among the first 25 applicants Your mission The Employee’s main duties and responsibilities are as follows: Responsibilities Work together with the process application team and be the key contributor in process qualification for our equipment during customer on-site...

Responsibilities Provide strategic direction and leadership for the 12\" bumping engineering team, aligning with company goals and objectives Oversee the development, optimization, and qualification of 12\" bumping processes, ensuring high yield, quality, and reliability Develop and execute a technology roadmap for 12\" bumping, staying ahead of industry...

**About NexGen Wafer Systems** Poised for growth with a footprint on three continents, we are executing our mission to become an internationally branded high-tech equipment provider. Are you ready for the next step in your career and interested in taking a important role in our organization? **What will you be doing? Reporting to the company’s Customer...