Equipment Engineer

**Company**: RF360 Singapore Pte., Ltd. **Job Area**: Engineering Group, Engineering Group > Hardware Engineering **General Summary**: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. **Minimum Qualifications**: - Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. **Responsibilities**: 1. Establish effective preventive maintenance programs and equipment troubleshooting guide. 2. Executive new equipment start-up, from facilities hook-up, vendor start-up, to acceptance of equipment for production. 3. Establish stock levels of essential spares and consumables to support equipment maintenance-based forecasted manufacturing volume. 4. Actively evaluate 2nd source part as part of cost reduction plan. 5. Drive/ contribute in equipment fault investigations and continuous equipment improvement project (CIP) to resolve chronic equipment issues, and institute permanent resolutions to assure product quality and enhance process robustness. 7. Take accountability of work and possesses strong sense of responsibility and teamwork. 8. Manage vendor services and supports and ensuring compliance with factory protocol. 9. Perform other duties assigned. Duties are varying according to project progress and/or for specific goal of the department 10. Manage vendor services and supports and ensuring compliance with factory protocol. 11. Establish, review and perform regular update of PM procedures, Risks Assessments and Troubleshooting guidelines. 12. Create technical specification for new and transferred equipment. 13. Execute the equipment move-in, installation, set up and buy-off, meeting set timelines. 14. Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol. **Education/Experience Requirements** 1. Master’s or Bachelor’s Degree in Electrical and Electronic Engineering, Microelectronics, Mechanical Engineering or Mechatronics Engineering 2. Knowledge in semiconductor process technology in Wafer-Fab or Pre-Assembly or Backend-Assembly. Wafer-Bonding / Wafer-Dicing / Wafer-Grinding. 3. Possess strong technical competencies in his field of study. 4. Good knowledge of statistical and quality tools. 5. Ability to work independently, be hands-on and expected to dive into technical details as required. **Skills, Abilities & Knowledge** 1. Preferably 2 years of Semiconductor wafer-fab or Pre-assembly or Backend-assembly processes - Wafer -Bonding / -Dicing / -Grinding equipment experience. 2. Good communications and interpersonal skills, and good team player. 3. Systematic troubleshooting and problem-solving skills. 4. Application of quality and SPC tools at work. 5. Dynamic, resourceful, creative, innovative and self-driven. 6. A strong analytical mind and able to organize works to identify the root cause of problems. 7. Able to multi-task, set priorities and meet deadlines. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. If you would like more information about this role, please contact Qualcomm Careers.