Postdoctoral Associate
2 days ago
**Project Overview**:
This program aims to pioneer a wafer-scale integrated platform which seamlessly combines metasurface optics, optoelectronic devices with a focus on light emitting diodes (LEDs) and vertical surface emitting laser arrays (VCSELs), and silicon complementary metal-oxide semiconductor (CMOS) electronics.
**Responsibilities**:
1. Perform cleanroom processing tasks including (but not limited to): photolithography, deposition of dielectric thin films, grinding and polishing of wafers, wafer bonding, thermal processing of wafers, wafer cleaning with wet chemistry.
2. Carry out characterization of wafers, including: microscope inspection, wafer bow measurement, surface morphology, electron microscopy, photo/electroluminescence, and working with external measurement service provider.
3. Coordinate and interface with external foundries on wafer-scale integration and advanced packaging process development.
4. Work with a team to fulfil wafer production planning and output, and lead the continual improvement project for wafer-level integration.
5. Perform other duties as assigned.
**Requirements**:
1. Ph.D. Degree in Materials Science, Mechanical Engineering, Electronic/Electrical Engineering, or any related discipline.
2. Prior experience in the semiconductor area (e.g. working in cleanrooms, handling semiconductor wafers/components etc.) is helpful, and experience operating cleanroom tools is preferred.
3. Prior experience in semiconductor foundry tape-out is preferred.
4. Experience in die/wafer advanced packaging is a plus and will be considered favourably.
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