Packaging Engineering Program Manager

**Our vision is to transform how the world uses information to enrich life for all. **Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

**Technology development**:

- New product scoping and definitions and sometimes with immediate support to BUs, and Customers.
- Define, develop new package requirements, develop Roadmaps, Scope, and include Customer requirements in development roadmap along with schedules.
- Work well in advance on upcoming fab nodes on new die designs to assure that die can be packaged as required in roadmaps, highlight risks with mitigation plans.
- Work with internal or external suppliers for assembly process development including equipment development as needed.

**New product Introduction**:

- Plans and develop characterization, qualification plans including BLR for new packages for alignment with margin analysis, product reliability & customer specifications
- Identify Risks and Mitigation Plans with new packages based on customer requirements.
- Using appropriate tools, performs integrity analysis of packages (includes FMEA, DFX & statistical analysis)

**Assembly Processes and Materials**:

- Prepares and/or updates various packaging & assembly specifications, Bill of Materials, and reports if necessary
- Coordinates with factories worldwide through all product life cycle phases to enable high volume introduction of new packages & assemblies
- Manage assembly yield improvement reviewing yield loss Pareto analysis
- Responsible for maintaining package / assembly road map for the product lines supported
- Extensive knowledge and familiarity with substrate design and substrate manufacturing process, die attach materials (DAF) and Molding compounds

**Representation**:

- Participates in cross-functional teams and ensures that package & assemblies are qualified and introduced into production in a timely manner while meeting all reliability and quality requirements

**Vendors**:

- Working with vendors for materials, processes, and equipment for next generation packages.
- Acts as a liaison while procurement or quality teams work with assembly subcons, substrates and materials vendors
- Maintains product quality while developing and introducing cost reduction programs

**Specific Role Description: Includes the following but not limited to**:

- Highly functional technical program manager of Package Engineering representing in cross-functional teams
- Represent Packaging in Business Unit meetings and reviews
- Guide and technical collaborator to offshore factories, OSATs on package and materials development

**Requirements**:

- MS EE degree
- Experience in package substrate design or signal integrity analysis
- Technical program management in package assembly area

**Additional Job Description**
Performs hardware, software, semiconductor design or telecom engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

**About Micron Technology, Inc.**

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.