Pde Td Pi, Sr./engineer

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JR10544 PDE TD PI, Sr./Engineer

**As Sr/Engineer for PDE Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for NAND, mNAND and DRAM, Controller in Micron. To drive new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to understand Frontend Process, packaging requirements, chip/package interaction, equipment capability and process technology in the industry and the ability to enable best technology for New Technode & Product Introduction with assembly packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve assembly process related problems.**:
**Ensure smooth transition from new process development, 1st qualification success to small volume production launch**:

- Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode (NPI) requirements and schedule
- Perform process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
- Lead/collaborate with cross function team/site, to ensure successful transfer to CEM for LVM.
- Qualify new process/technology/equipment/materials
- Implement PDE TD PMI (Product Maturity Index) methodology & provide proper Documentation for product transfer CEM & HVM

**Technical capability**:

- Identify path finding opportunities for continuous yield improvement and cost reduction activities
- To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
- Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.

**Provide new solutions on time to meet company and customer needs**:

- Define, develop and establish process capabilities, strategy and roadmap
- To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.

**Job Requirements**:

- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- 2 years' experience in semiconductor industry
- Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology
- Understanding of Micron’s silicon and how it interacts at backend process & package level through CPI is a plus
- Strong project management skills to ensure execution to timelines
- Strong communication and presentation skills
- Understanding of business needs and customers’ requirement
- Ability to integrate & cooperate with people from cross function teams

**About Micron Technology, Inc.**

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.