Plating & Etching Process Engineer

2 weeks ago

Singapore SSCK PTE. LTD. Full time $90,000 - $120,000 per year

Key Job Responsibilities:

  • Develop and optimize electroplating, seed etching, and PR stripping processes
  • Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation
  • Evaluate and introduce new materials and equipment for plating/etching process integration
  • Conduct pre-production process validation and yield stabilization
  • Perform DOE planning and analyze experimental data using statistical tools (e.g.,SPC, Minitab, JMP)
  • Develop customized processes and provide technical support for customer programs
  • Set up equipment and optimize operating conditions in coordination with vendors
  • Troubleshoot quality issues across plating and etching processes
  • Support development of advanced packaging technologies including 2.5D, fan-out, and SiP

Qualifications:

  • Bachelor's degree or higher in Engineering or Science (e.g., Materials Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials)
  • Minimum 3 years of hands-on experience in plating, etching, or stripping processes in semiconductor manufacturing
  • Fundamental understanding of advanced semiconductor fabrication and integration processes
  • Strong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reporting
  • Proficiency in preparing technical documentation and delivering presentations
  • Ability to communicate technical content clearly in English (written and verbal)
  • Basic knowledge of semiconductor process equipment and materials
  • Experience in key back-end processes such as TSV, RDL, and micro bump
  • Knowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chip
  • Familiarity with related processes such as photo, chip attach, and underfill
  • Proven experience in joint development projects with global customers
  • Hands-on collaboration with material or equipment suppliers for co-evaluation or integration
  • Expertise in process reliability testing (e.g., thermal cycling, HAST)
  • Experience in process automation or smart fab environments
  • Working proficiency in tools such as AutoCAD or ANSYS
  • In-depth understanding of etch/strip conditions for back-end photoresist materials

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