Dicing Process Engineer

1 week ago

North Region, Singapore Heptagon Photonics Pte Ltd. Full time $120,000 - $180,000 per year

Job Description

The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company's mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon substrates. The engineer will drive innovation in wafer-level processing, support new product introductions, and ensure manufacturing excellence through continuous process improvement.

Job Requirement

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field.
  • Minimum 5 years of hands-on experience in wafer dicing process development, preferably in semiconductor or photonics industries.
  • Proven track record of developing and scaling dicing processes for glass and silicon wafers.
  • Deep understanding of wafer materials, mechanical properties, and dicing-induced stress.
  • Proficient in common tools such as IE, SPC, PFMEA, CP, MSA, and NPI.
  • Familiarity with Cleanroom practices and wafer handling protocols.
  • Strong Problem-solving and communication skills.
  • Strong Team spirit, sense of responsibility, result-oriented mindset and practical work ethics.

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