R&D Senior Application Engineer
2 weeks ago
Job Responsibilities:
- Non-Pressure Silver Sinter Paste Development & Application Validation from PDP G2 to G5
- TIM1 Paste Application Validation for product development from PDP G2 to G5
- Lead Best-Known Methodology Projects for NP sinter paste and TIM1
- Validate NP Ag Sinter Paste CD projects from Stage B to C
- Collaborate on functional excellence projects
- Train new engineers and share knowledge across sites
- Perform preventive maintenance of equipment and manage inventory of test materials
Job Requirement:
- Bachelor's or Master's degree in Engineering (Materials, Mechanical, Electrical & Electronics, Physics, or Chemistry preferred).
- Minimum 5 years in solder/assembly materials for semiconductor applications.
- Expertise in stencil printing, dispensing, die attach, flip chip bonding, flux dipping, and reflow processes.
- Ability to optimize process parameters for advanced equipment.
- Strong technical support skills for internal teams and customers.
- Proficiency in Six Sigma methodologies and problem-solving tools (JMP, Minitab, SPC, DOE, etc.).
- Hands-on experience with ASM DEK printer, ASM SiPlace, Besi Datacon, ESEC Die Bonder, Musashi dispensing platforms (highly desirable)
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