Mechanical Engineer
7 days ago
About Our Client
Our client is a pioneering force in the semiconductor advanced packaging and electronics manufacturing service industries. With their R&D center based in Singapore, they focus on developing innovative products and solutions for high-precision applications. Their product range includes advanced Die Bonders, Flip Chip Bonders, and Package-on-Package Bonders, which significantly enhance their customers' operational efficiency.
What you'll be doing?- Design and develop: Create innovative mechanical components that meet specific requirements for advanced semiconductor packaging equipment.
- Product lifecycle management: Oversee the entire product development process from initial design to implementation, ensuring quality at every stage.
- Problem-solving: Analyze and resolve technical issues, developing effective solutions to improve product performance.
- Innovation: Conduct experiments and evaluations to enhance existing designs and create new, cutting-edge products.
- Technical documentation: Prepare comprehensive documentation for machine operators, ensuring clear communication of operational procedures.
- Collaboration: Work closely with project managers and fellow engineers to achieve project goals and maintain high standards of quality.
- Vendor management: Liaise with suppliers to finalize equipment modules and ensure seamless integration.
- Compliance: Ensure all products meet relevant industry regulations and safety standards.
- Educational background: Candidates with a Bachelor's Degree in Mechanical or Mechatronics Engineering, bringing a strong foundation in engineering principles.
- Technical proficiency: Demonstrate solid experience with CAD, CREO, CAM, and Matlab/LabView programs, essential for designing and simulating mechanical systems.
- Industry experience: About 2-3 years of field technical experience in a Semiconductor environment or related industrial setting with strong equipment knowledge.
- Troubleshooting skills: Experience in diagnosing and resolving issues with PC-based fully automatic equipment in semiconductor or other industrial applications.
- Equipment expertise: Good understanding of equipment control and troubleshooting methods, with knowledge of die bonder applications being a plus.
- Analytical mindset: Strong problem-solving abilities and keen attention to detail, crucial for developing innovative solutions.
- Communication skills: Ability to write clear, comprehensive technical documentation and collaborate effectively with team members.
- Working Day: Mon to Fri
- Location: Woodlands North Coast
- Salary: $4500 - $6500
Ready to join this role? Click Apply now to submit your resume and share your availability and expected salary with us
We welcome applications from candidates with diverse backgrounds and experiences. Your unique perspective could be just what we're looking for
All information received will be kept strictly confidential and will be used only for employment-related purposes.
Jobs DB Singapore Pte Ltd | 24C2640
Low Jia Yi | R
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