
Process Associate Engineer
2 days ago
About Stats ChipPAC
At Stats ChipPAC, we are at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow's technology — from mobile devices to high-performance computing. Join our dynamic team where innovation, teamwork, and excellence drive our success. We are employing Advanced Manufacturing Technologies in our Wafer-Level Packaging operations with wide adoption of Automation, AI-enabled inspection and Autonomous Mobile Robots (AMR) as substitute to manual operations.
Scope of the Job:
- Manage the assigned processes in the production line.
- Responsible for firsthand investigation, defect mapping, affected lot list compilation and resolution of the problem, timely closure of Inspection Reject Report and lot disposition.
- Support NPI lot, engineering evaluation runs and data compilation.
- Responsible for recipe creation, machine buyoff and SPC monitoring.
- Participate in the cost saving, yield improvement and productivity activities.
Required Experience and Qualifications:
- Diploma in Mechanical and Material Engineering or equivalent.
- Experience in the following Semicon processes is preferred: Die/Package Pick & Place, Oven Reflow, Underfill, Molding, Plasma and Laser Mark, Back Grind, Die Sort, Laser Groove, Wafer Saw, AOI and Yield.
- Strong process orientation.
- Good Initiative & follow-up.
- Great problem-solving skill.
Why Join Us?
Be part of an industry leader shaping the future of semiconductors
Work with cutting-edge technologies and state-of-the-art equipment
Clear career development pathways and mentorship from industry experts
Dynamic, multicultural workplace that values collaboration and innovation
Comprehensive benefits and employee-centric policies
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