Lead Software Control Engineer – Semiconductor Equipment

7 hours ago


North Region, Singapore f60f3d38-e58b-457f-b8b1-2f342ebf10a1 Full time $120,000 - $180,000 per year
About the Role

PYXIS CF is developing a new Thermocompression Bonder (TCB) platform for HBM, CoWoS and 2.5D/3D semiconductor packaging. We are hiring a Lead Software Control Engineer to architect and implement the core control software for multi-axis motion, real-time synchronization, and precision bonding algorithms.

Key Responsibilities
  • Lead real-time software development for multi-axis motion control (XY-θ-Z)
  • Design control loops for micro-Z height, force feedback, and thermal ramp/soak control
  • Implement deterministic control using EtherCAT, TwinCAT, ACS SPiiPlus, or PMAC
  • Architect the full software stack for bonding sequence timing and machine coordination
  • Integrate servo drives, motor controllers, sensors, heaters, and calibration systems
  • Develop diagnostic, calibration, safety, and error-recovery routines
  • Collaborate with mechanical, electrical and process teams to optimize bonding performance
  • Mentor junior software engineers and define coding standards
Requirements
  • Bachelor's/Master's in Software, Electrical, Computer Engineering, Mechatronics, or related
  • 5–15 years of experience in motion control, automation, or semiconductor equipment
  • Strong experience with real-time control, C/C++, and PID-based systems
  • Hands-on knowledge of EtherCAT, TwinCAT, ACS SPiiPlus, or PMAC
  • Experience with servo drives, encoder feedback, and high-precision synchronization
  • Ability to debug motion/force/thermal interactions using oscilloscopes, logic analyzers
  • Experience working in R&D environments developing high-precision machinery
Good to Have
  • Semiconductor packaging equipment (die bonder, flip-chip, TCB)
  • GPU/vision system integration
  • Thermal control systems and high-speed bonding process experience

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