Dry Process Engineer

5 days ago

Singapore ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD. Full time $120,000 - $180,000 per year

Job Responsibilities

Process Development & Optimization

  • You'll own the development and optimization of dry processes including film deposition and etching for advanced packaging solutions.
  • Collaborating with cross-functional teams to lead innovations in deposition & etching and their implementation efforts

Equipment & Tooling Support

  • Active part of defining deposition and etching equipment specifications and validating tools.
  • Work with supplier teams to monitor and maintain tool performance.

Yield & Quality Improvement

  • Implement and refine process monitoring techniques and defect inspection, to proactively investigate and resolve issues with dry processes.

Process Integration

  • Collaborate with upstream and downstream process owners (e.g., lithography, plating, wet processes, metrology) to ensure seamless integration.
  • Support the development of process flows for advanced packaging substrates.

Data Analysis & Documentation

  • Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. Experience with data analysis software packages (such as MATLAB, Python, SQL, JMP)
  • Document standard operating procedures (SOPs), work instructions, and control plans.

Cross-Functional Collaboration

  • Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
  • Assist with customer qualifications and reliability testing as needed.

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications:

  • PhD or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
  • 5–10+ years of experience in film deposition and dry etching

Specialized Knowledge & Skills:

  • Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
  • Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
  • Strong analytical, documentation, and problem-solving skills.
  • Good communication and teamwork in a cross-functional environment.
  • Familiarity with using metrology tools for thin film and etch characterization (e.g., XRF, 4PP, ellipsometry, profilometer).
  • Takes part in product risk management discussions leveraging his / her expertise and knowledge to influence and drive risk management decisions.
  • Using AI/ML to enhance process discovery

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