Principal Engineer, Package Technology
1 week ago
As a Principal Engineer, Package Technology, you would be conducting technical feasibility of new package design and make recommendation to address delta
In your new role you will:
- Conduct **t **echnical feasibility of new package design **and make recommendation to address delta
- Assess compliance to **Bonding Diagram (BD), Design Rules (DR), Bill of Materials (BOM), and Process Block (PB **) to already established guidelines
- Collaborate with designer, characterization and material team to initiate required analysis to address gaps identified
- Quantify potential impact of new technology implementations on overall package cost and make recommendations to achieve cost targets
- Reduce complexities in processes by reviewing and harmonizing BOM,PB, and DR.
- Provide technical support to project managers during **new package technology qualifications and technical risk assessments (DFMEA and PFMEA) **and ensure timely and effective solutions are deployed to identified risks.
- Provide technical support to Innovation Team to assess viability of new technologies for cost, stability and DFM.
You are best equipped for this task if you have:
- Master's/ Bachelor's Degree in Chemical/ Electrical/ Mechanical/Materials Engineering
- More than 5 years in **Package Development **/ **NPI/ Process Assembly **in a matrix organization, exposure to IPM highly desirable
- More than 4 years managing and leading technical teams (2 to 4 engineers)
- Understands **FE-BE, chip-package, assembly materials-processes interactions**:
- Proficient in **APQP, DOE, FMEA, and Six Sigma**:
- Knowledge in **DR, BD, BOM **, and equipment capability
- Knowledge in failure mechanism and failure analysis of assembly and test-related defects
- Very hands-on technical person or the potential to be a leader and desire to lead
**Part of your life. Part of tomorrow.**
Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.
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