Staff Engineer, Product Design

2 days ago

Singapore ams-OSRAM Asia Pacific Pte. Ltd. Full time

The CSA division supplies sensors that bridge the gap between the world we live in and the digital world of machines. By converting physical signals - heartbeats, sounds, light waves - into data, we enable robots, cars and other devices to interact with people and improve our world. What drives CSA is a relentless desire to contribute to technology and have a meaningful impact on the world. This business thrives on solving complex problems and partnering with global leaders at the forefront of technological advancement. Our goal: to push the boundaries of sensor technology and empower innovators to make the world smarter, healthier and happier.
- Designer of module developed for consumer, industrial and automotive sensing market and conduct design assessment (feasibility, concept, risks) for all new product design product.
- Deep knowledge in SolidWorks, AutoCAD and COMSOL (or any other equivalent) Software hence, able to create 3D model, 2D drawing and conducting FEA simulations for any given design
- Leading design review for internal and external customer’s design and provide DFM feedback/suggestion based on design tolerance analysis, vendor’s DFM and in-house process manufacturing capabilities.
- Work closely with cross functional teams such as product engineering, process engineering, IQC, SQE, APQ, and OQC team during product development phase to ensure the build deliveries per project schedule.
- Support Rel lab for test socket and test board design by project.
- Conduct tooling design (PnP collet, JEDEC/Waffle tray) check & buyoff via TA & 3D model simulation.
- Degree/master’s in mechanical engineering or Materials Engineering
- Proficiency in SolidWorks and AutoCAD is a must.
- Experience in Altium/Cadence for PCB test board routing (electrical background) design would be a plus point.
- With substrate and flex printed circuit (FPC) design knowledge (understand the design rules).
- With PCBA knowledge: PCB dicing, die attach, wire bond process, wire bond encapsulation etc.M41
- Experience in packaging in transfer molding or compression molding technology would be plus point.

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