Senior Mts, Package Development
2 days ago
**Job Summary**:
**Responsibilities**
- Lead in new package / platform development from concept to package platform release both internally and externally. File for IP on new patentable developments.
- Define package needs based on product roadmap, horizons and market trend to maintain leadership position.
- Strong interaction with Manufacturing, Reliability and Business Units to close engineering gap and smoothly production transfer.
- Represent Package Development organization with cross-functional team and work with Silicon Architecture / Internal Circuit Design Engineers to translate new product features and specifications into package technology requirements.
- Define risk assessment and risk mitigations plan, Bill of Material (BOM) selection, process flow.
- Build in depth technical competencies to handle package and assembly technical challenges.
- Initiate Package Proof of Concept (POC) ahead of new product development to establish value proposition.
- Timely development and introduction of new packages/products with performance, quality, reliability, Design for Manufacturability, cost competitiveness in consideration
**Requirements**:
- BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
- More than 15 years of experience in semiconductor packaging and manufacturing
- Possess analytical skills such as for process, materials, and assembly equipment parameters
- Strong communication skills to be effective in dealing with Business Units, cross-functional teams, internal or external manufacturing and customer
- Proficiency in Engineering Tools such as AutoCAD, 8D, SPC, DFMEA, DOE
- Lead project across organization and culture in a fast-paced environment
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