
Intern - New Package Development
1 week ago
**Our vision is to transform how the world uses information to enrich life for all.**
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR50979 Intern - New Package Development
Description
Intern - New Package Development
Department
MSB Package Development Engineering (PDE) Core Engineering Module (CEM)
Project Title
Intern - Comprehensive study of die attach film (DAF) separation process
**Job Description**:
1. Scope
1) Learn on overall Memory assembly process
2) Familiarization with wafer thinning and dicing process
3) Detail study of die separation process step with different DAF material
4) Learn on wafer inspection with automatic optical inspection (AOI) tool
2. Deliverable
To have overall understanding of memory assembly process, focus on die separation study.
3. Skillset Required
material or mechanical
4. Course of interests
material science & Engineering; Mechanical Engineering;
5. Duration Period
Per intern requirement
**About Micron Technology, Inc.**
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
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