
Packaging Designer
7 days ago
**Position Summary**
**Packaging Designer (BGA & Substrate & WLCSP) **is responsible for product and tooling design.
**Key Responsibilities**
- With reference to internal design guidelines, work with the internal & external customer to:
- Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
- Generate test vehicle design and the related PCB design.
- Prepare design risk assessment report.
- Generate reticle and stencil design.
- Generate other schematics or drawing as requested.
- Review, maintenance and update the design guidelines.
- Manage the conversion of internal design into suppliers’ final design.
- Document all the drawing revisions and change records.
- Support audits
**Requirement**
- 2 years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant.
- Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability.
- Familiar with other design software like Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors.
- Familiar with PCB test board design.
- Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process will be the advantage.
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