Sr Manager/manager, Advanced Packaging Technology Development

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Key responsibilities and duties include:
Develop and Communicate Advanced Packaging Technology Development Strategy
- Develop and communicate Advanced Packaging Technology Development strategic objectives
- Understand the impact and implications of APTD strategy to the overall company strategy and direction

Technical Leadership
- Set fiscal year technical objectives and insure they are aligned with department objectives
- Demonstrate understanding of technology complexity and effective technology decision making
- Provide technical leadership that may influence company direction

Multi-Functional Leadership
- Represent APTD in providing cross department leadership in area of responsibility
- Work effectively with peers in other department to develop and drive multi-functional initiatives

Impact and Execution
- Ensure accuracy, quality, and timeliness of results
- Guide best utilization of resources to achieve end results
- Ensure critical work, milestones and goals are met by the team

Growth Mindset
- Continue to build new skills through development goals and learning events.
- Seek out opportunities to work multi-functionally, build a network, and gain competency across domains

Training and Development:

- Conduct performance appraisals with team members to create goals and development plans
- Mentor other engineers and engage in continued learning to stay updated with the latest advancements in packaging technology

**Requirements**:

- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
- Experience with Visual Basic for automation and tool integration.
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
- Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions
- Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
- Consistent track record to solve problems and address root causes
- Ability to multi-task and manage numerous projects simultaneously
- Tenacity to work effectively under timelines and limited resources

**About Micron Technology, Inc.**

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

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