
Senior Staff Engineer, Packaging
1 week ago
**Singapore, Singapore, Singapore — ams-OSRAM AG**:Bringing intelligence to light and passion to innovation
The ams OSRAM Group is a global leader in optical solutions. By adding intelligence to light and passion to innovation, we enrich peoples' lives. This is what we mean by Sensing is Life. Our around 26,000 employees worldwide focus on innovation across sensing, illumination and visualization to make journeys safer, medical diagnoses more accurate and daily moments in communication a richer experience.
The Image Sensor Solutions business aims to become the uncontested leader in optical imaging solutions extending human vision. ISS products are mainly produced in Austria and Singapore.
Your new responsibilities
- To take a role of Direct Responsible Individual for Module Reconstruction and Attach Process for both Customers Product Development and Technology Development Projects.
- Customers Product Development scopes include Spock supported products
- Develop, Configure and Optimize Module Reconstruction and Die Attach Assembly Processes
- Conduct Design of Experiments and execute the Experiments/ Evaluations upon required for New Process Setup, Machine Qualification or Material Qualification
- Define Critical Process Parameters and Measurement Methods
- Develop Process Control Plan, Perform Risk Assessments and Mitigation Plan, Prepare OCAP
- Develop best practices, routines and innovative solutions to meet Project Goals, improve Production Rates and Quality
- Provide Process Documentations and Operating Instructions
- Support for Responsible Process to meet Project Timeline
What we look for
- Engineering Degrees; Prefer specialization in Material Science, Mechatronics, Mechanical and ECE
- Engineering Diploma with relevant 3 years work experiences
- Process Experience for Die Attach, Module Reconstruction, Glue Dispensing/ Jetting (Must Have)
- DOE, Statistical Process Control (Must Have)
- Experience with Process Control Plan, Technical Risk Assessments, Operating Procedure Preparation (Must Have)
- Datacon Machine Experience (Must Have)
- Experience working in similar industries (Nice to Have)
- Experience on Semiconductor Epoxy/ Glue Material (Nice to Have)
- Experience on Semiconductor Tape Material (Nice to Have)
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