Current jobs related to Senior/ Engineer, Advanced Packaging Die Level Technology Engineering - Singapore - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD
-
Singapore Micron Technology, Inc Full timeOur vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all...
-
Singapore Micron Memory Malaysia Sdn Bhd Full timeOur vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all...
-
Singapore Micron Memory Malaysia Sdn Bhd Full timeOur vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all...
-
Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full timeRoles & ResponsibilitiesMicron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual...
-
Singapore Micron Memory Malaysia Sdn Bhd Full timeOur vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all...
-
Singapore Micron Full time**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...
-
Packaging Die Level Technology Specialist
4 days ago
Singapore beBee Careers Full timeAbout the Job: We are seeking a highly skilled Senior Engineer to lead the development and integration of advanced packaging technologies. The successful candidate will have a strong background in process development and integration, as well as experience working with cross-functional teams.Key Responsibilities:Process Development:Develop and optimize...
-
Advanced Packaging Die Expert
4 days ago
Singapore beBee Careers Full timeJob OverviewThis is a high-performance memory solutions developer position in which you will be responsible for developing and optimizing assembly processes for advanced packaging technologies.Primary ResponsibilitiesDevelop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer,...
-
Advanced Packaging Engineer
4 days ago
Singapore beBee Careers Full timeJob DescriptionWe are seeking a highly skilled Advanced Packaging Die Level Technology Engineer to join our team.Key Responsibilities:Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.Focus on improving product quality, driving yield improvements,...
-
Advanced Packaging Engineer
5 days ago
Singapore beBee Careers Full timeAbout the RoleWe are seeking an experienced Advanced Packaging Die Level Technology Engineer to join our team.This is a critical role in driving the development and deployment of advanced packaging technologies, enabling the creation of high-performance memory products.Develop and optimize assembly processes for advanced packaging technologies.Evaluate and...
Senior/ Engineer, Advanced Packaging Die Level Technology Engineering
3 weeks ago
Micron's vision is to transform how the world uses information to enrich life for all.
Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.
We are looking for an Advanced Packaging Die Level Technology Engineer to join our Advanced Packaging Technology Development (APTD) team
Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.
Key responsibilities and duties include:
Process Development:
Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
Establish and improve process management projects to deliver technology node requirements
Equipment and Materials:
Evaluate and promote new equipment and materials to enhance process capabilities
Set up process parameters for a variety of semiconductor equipment
Evaluate, promote, and plan for new equipment and materials
Quality Improvement:
Ensure defense coverage through process, measurement, inspection, and testing
Establish correlations between defense mechanisms to identify improvement opportunities
Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Collaboration and Coordination:
Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
Ensure smooth transition from new product development, qualification, small volume production to high volume production
Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
Requirements
B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field
Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
Tenacity to work effectively under timelines and limited resources
Consistent track record to solve problems and address root causes
#J-18808-Ljbffr
