Thermo Compression Bonding Engineer

Description TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role OverviewThe Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal Compression Bonding (TCB) processes for advanced semiconductor packaging. The role involves working with inert gas environments (Nitrogen systems), Formic Acid vapor handling, Clean Room integration, and Plasma-based oxide removal systems. The position requires cross-functional collaboration to ensure process stability, safety, and performance. Key Responsibilities Design and develop oxygen control and purge systems for TCB equipment to achieve ultra-low oxygen environments. Develop nitrogen and formic acid gas delivery systems ensuring safety, flow uniformity, and chemical compatibility. Design plasma cleaning systems for oxide removal on incoming wafers and substrates prior to bonding. Integrate gas handling, exhaust, and pressure control modules within bonder chambers. Ensure compliance with cleanroom standards and contamination control requirements. Conduct CFD and thermal analysis to evaluate gas flow, heat distribution, and oxygen diffusion during bonding. Select appropriate materials for components exposed to formic acid, plasma species, and high temperatures. Develop safety interlocks and control schemes for handling flammable or corrosive gases. Collaborate with process, equipment, and controls engineers to align designs with process needs. Support installation, commissioning, and troubleshooting at customer or manufacturing sites. Qualifications Bachelor’s or Master’s degree in Mechanical Engineering or related discipline. Minimum 5+ years of experience in precision equipment design for semiconductor, display, or vacuum systems. Experience with oxygen and humidity control, nitrogen purge, and formic acid vapor systems. Experience with plasma cleaning or surface activation systems. Proficiency in 3D CAD tools (SolidWorks, Creo, or NX) and thermal/flow simulation tools (ANSYS, COMSOL). Understanding of chemical compatibility, gas flow control, and vacuum-sealing techniques. Familiarity with TCB, CoWoS, or hybrid bonding environments preferred. Experience with mass flow controller (MFC) calibration and integration. Knowledge of oxidation kinetics and surface chemistry in bonding processes. Familiarity with automation and control systems (PLC, sensors, feedback loops). Experience with cleanroom mechanical design and safety certifications. ✅Interested personnel kindly send your CV to WhatsApp: (Ethan) #J-18808-Ljbffr