Laser-Assisted Bonder process engineer | Semicon | LAB
5 days ago
Position title : Laser-Assisted Bonder (LAB) process engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Interested applicants can also send your resume to WA: (Ms Angel) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered. Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding. Key Responsibilities Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput. Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams. Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products. Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams. Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA). Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology
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Laser-Assisted Bonding Process Engineer
12 hours ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : Laser-Assisted Bonder (LAB) Process Engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes -especially in high-precision, high-reliability Advanced...
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Singapore The Supreme HR Advisory Full timeA leading recruitment agency is seeking a Laser-Assisted Bonder (LAB) Process Engineer based in Singapore. Responsibilities include developing, optimizing, and maintaining laser bonding processes within advanced packaging applications. Ideal candidates will have a degree in engineering and experience in semiconductor packaging. This role offers a competitive...
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Laser Bonding Process Engineer
5 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeA leading recruitment firm in Singapore is seeking a Laser-Assisted Bonder (LAB) Process Engineer. The role involves developing and optimizing laser bonding processes for advanced packaging. Candidates should have a degree in engineering and 2-5 years of relevant experience, particularly in semiconductor packaging. Familiarity with laser technologies is...
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Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeLaser-Assisted Bonder (LAB) process engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes-especially in high-precision, high-reliability Advanced Packaging application for...
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Singapore The Supreme HR Advisory Full timeA recruitment agency is seeking a Laser-Assisted Bonder (LAB) Process Engineer in Singapore. The role involves developing, optimizing, and maintaining laser bonding processes for advanced packaging applications. Candidates should have a Bachelor's or Master's in a relevant field and 2-5 years of experience. Familiarity with laser-assisted bonding...
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LAB Process Engineer
12 hours ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : Laser-Assisted Bonder (LAB) process engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes-especially in high-precision, high-reliability Advanced...
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Semiconductor Process Engineer
5 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeLaser-Assisted Bonder (LAB) process engineer Location: Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging...
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Laser-Assisted Bonding Engineer
5 days ago
Singapore The Supreme HR Advisory Full timeLaser-Assisted Bonding Engineer - Advance Semiconductor Packaging Position title : Laser-Assisted Bonding Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes...
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L.A.B Process Engineer
1 week ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeLaser-Assisted Bonder (LAB) Process Engineer Location: Admiralty Working Days: 5 days a week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends on experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging...
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Semiconductor Bonding Laser Engineer
5 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title: Semiconductor Bonding Laser Engineer Location: Admiralty Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging...
