Senior/ Engineer, Advanced Packaging Integration Engineering

Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities.
Micron's vision is to transform how the world uses information to enrich life for all.
Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.
We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team
Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.
Key responsibilities and duties include:
Technology Development:
Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
Integrate semiconductors while partnering with process and product engineering teams.
Yield Improvement:
Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements.
Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes.
Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements.
Quality Improvement:
Ensure defense coverage through process, measurement, inspection, and testing.
Establish correlations between defense mechanisms to identify improvement opportunities.
Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
Collaboration and Coordination:
Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives.
Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.
Ensure smooth transition from new product development, qualification, small volume production to high volume production.
Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities.
Requirements:
B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields.
5 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes.
Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering teams.
Ability to resolve complex issues through root-cause or model-based problem solving.
Tenacity to work effectively under timelines and limited resources.
Consistent track record to solve problems and address root causes.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands.
To learn more, please visit
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
#J-18808-Ljbffr