
Senior Technology Integration Specialist
6 days ago
Senior Technology Integration Specialist
The Advanced Packaging Process Integration team is seeking an experienced professional to develop cutting-edge technologies and solutions for integrated modules. This role involves designing, planning, and executing wafer splits/lot runs using design of experiment methodologies to co-optimize unit processes.
- Develop 2.5D/3D process technologies and solutions for Advanced Packaging including Bump/Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding.
- Plan wafer splits/lot runs with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
- Process and manage wafers/lots through integrated lines/process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
This role requires a strong background in semiconductor technology and processing in cleanroom environments. Proficiency in Advanced Packaging architecture and process flow is advantageous. Experience in Unit Processes BEOL & Packaging Assembly Unit Process will be beneficial.
The ideal candidate will possess excellent problem-solving skills, ability to work independently, and drive projects to completion. A Bachelor's, Master's, or Doctorate in STEM disciplines is required.
Key Responsibilities:
- Develop and implement new process technologies.
- Analyze and improve existing processes.
- Collaborate with cross-functional teams.
Requirements:
- 10 years of experience in semiconductor technology and processing.
- Advanced Packaging knowledge.
- Unit Process experience.
What We Offer:
- A dynamic work environment.
- Opportunities for growth and development.
- Competitive compensation and benefits.
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