Senior MTS, Advanced Packaging Integration

Senior MTS, Advanced Packaging Integration page is loaded## Senior MTS, Advanced Packaging Integrationlocations: Singapore,SGPtime type: Full timeposted on: Posted Todayjob requisition id: R **Who We Are**Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.**What We Offer**Location:Singapore,SGPYou'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our .**About the Role**We are seeking a highly skilled **Advanced Packaging Integration Engineer** to join the **Applied Materials Advanced Packaging Disruptive Technology** team. This role focuses on advanced advanced **packaging process integration**, with a focus on **thin film deposition and etching techniques** towards driving innovation and ensuring seamless integration across manufacturing processes. This technical staff position leads and/or develops and executes exceptionally complex technology and engineering projects and leads research and development of new technologies as appropriate.**Key Responsibilities****Advanced Packaging Process Development*** Define and implement process flows for **panel-level packaging** and other advanced panel technologies.* Drive material selection and compatibility studies for large-format form factors.* Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.* Develop innovative solutions as part of proven track record of significant technology contributions. Recognized internally (across Business Units)as one of the limited number of technical experts in their field of expertise* Conceive and implement new technology, normally named as primary inventor on numerous critical patents and recognized through awards and/or published papers within the last five years.* Leads and collaborates to contribute to the development of new principles and concepts. Guides less experienced engineers in utilizing techniques to define methods and new technologies and apply them on unusually complex systems. Involved in judging the approach and verifying the validity of technical strategies.**Functional Knowledge*** Optimize thin film deposition techniques such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) (Including PECVD for low-temperature applications), Atomic Layer Deposition (ALD) for atomic-scale control and high-k dielectrics.* Electrochemical Deposition (ECD): For metal layers in advanced packaging.**Cross-Functional Collaboration*** Works with business unit in technology development and