CoW Development Engineer

3 days ago

Singapore SSCK PTE. LTD. Full time

Purpose of the Job: To support R&D activities for 2.5D wafer-level packaging (WLP) processes-including Die Preparation, Chip Attach, and Mold-focusing on process reliability, manufacturability, and integration for advanced semiconductor packages. Key Job Accountabilities: Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die Preparation: grinding, laser grooving, dicing saw Chip Attach: TCB (Thermo-Compression Bonding), LCB (Laser Compression Bonding) Mold: compression or

  • TCB Design Engineer

    1 week ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Position title: TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: 8 Admiralty Street #06-13, Singapore Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience)Overview Role Overview: We are seeking a Mechanical Design Engineer with expertise in designing die...

  • TCB Design Engineer

    3 days ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for...

  • TCB Design Engineer

    24 hours ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

  • Design Engineer

    5 days ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: 8 Admiralty Stree Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging...

  • TCB Design Engineer( Die Ejection

    5 days ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No...

  • TCB Design Engineer( Die Ejection

    3 days ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients....

  • TCB Design Engineer( Die Ejection

    24 hours ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients....

  • Mechanical Design Engineer

    5 days ago

    Singapore Pyxis CF Full time

    We are seeking an experienced Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The ideal candidate will have hands‐on experience in ejecting ultra‐thin dies (down to 25 μm) from wafers and familiarity with Chip‐on‐Wafer (CoW) package handling for CoWoS assembly. This role demands a...

  • Mechanical Design Engineer

    5 days ago

    Singapore PYXIS CF PTE. LTD. Full time

    Job Overview We are seeking an experienced Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The ideal candidate will have hands-on experience in ejecting ultra-thin dies (down to 25 μm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands...

  • Design Engineer

    3 days ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: 8 Admiralty Stree Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...