Senior Semiconductor Process Specialist

4 days ago

Singapore beBeeEngineering Full time

**Application Engineer Role** ">

We are seeking a highly motivated and skilled Application/Process Engineer to join our Advanced Control & Test (ACT) team. This role is instrumental in supporting the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging.

The successful candidate will work cross-functionally to improve software and hardware integration, conduct root cause analysis, enhance process capability, and provide hands-on support to both internal teams and customers. Key responsibilities include leading the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes, analyzing customer requirements, conducting troubleshooting and failure analysis, and collaborating with R&D, software, mechanical, electrical, quality, and manufacturing teams.

  • Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
  • Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
  • Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
  • Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.

The ideal candidate should have a strong technical background, a proactive mindset, and a passion for driving technology adoption and continuous improvement in high-precision semiconductor equipment. A Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, or related field) is required, along with 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing. Excellent communication and interpersonal skills, as well as the ability to work independently and in cross-functional teams, are essential.

We offer a dynamic and challenging work environment, with opportunities for professional growth and development. If you are a motivated and skilled individual looking to make a meaningful contribution to the advancement of semiconductor packaging technologies, we encourage you to apply for this exciting opportunity.

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