Principal Test Solutions Engineer

2 weeks ago

Singapore Micron Semiconductors Full time

As a Principal High Bandwidth Memory (HBM) Test Solutions Engineer at Micron, you will serve as a technical leader and subject matter expert, driving the development, optimization, and deployment of advanced test solutions for HBM and DRAM products. You will provide expert-level training and consulting on Micron's DRAM Testers and HBM Testing Software, mentor junior engineers, and collaborate with global cross-functional teams to deliver innovative, production-worthy test technologies. Key Responsibilities Lead the architecture, development, and deployment of new test programs and algorithms for HBM and DRAM, covering both software and hardware aspects. Provide expert guidance on test program development using Python and C/C++ for automated test equipment. Drive New Product Introduction (NPI) and manage pre/post-silicon test activities, ensuring seamless transition to manufacturing. Develop and implement advanced test automation solutions, including electrical validation and qualification of new test equipment. Mentor and train engineering teams on HBM test methodologies, best practices, and Micron's proprietary test platforms. Lead root cause analysis and resolution of complex test issues, collaborating across internal and external groups. Apply advanced data analysis, statistical modeling, and machine learning techniques to optimize test flows and improve yield and quality. Champion innovation and continuous improvement initiatives to reduce Cost of Test and enhance test efficiency. Maintain strong relationships with global teams and vendors, ensuring alignment with product roadmaps and customer requirements. Communicate technical concepts effectively through presentations, documentation, and cross-team collaboration. Uphold and model Micron's core values: People, Innovation, Tenacity, Collaboration, and Customer Focus. Required Qualifications Bachelor's or Master's in Electrical Engineering, Computer Science, Computer Engineering, or related field. 10+ years of experience in DRAM/HBM test engineering, with proven hardware and software expertise. Deep knowledge of HBM/DRAM architecture, digital systems, and semiconductor manufacturing processes. Proficiency in C/C++, Python, and Unix/Linux environments. Demonstrated experience with test program development, debug, and release to manufacturing. Strong analytical, problem-solving, and leadership skills. Experience with version control and project management tools (e.g., Git, Bitbucket, Jira). Excellent communication and mentoring abilities. Preferred Qualifications Experience with machine learning and advanced data analytics for test optimization. Track record of innovation and process improvement in semiconductor test engineering. #J-18808-Ljbffr

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