Principal Etch Process Engineer

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Principal Etch Process Engineer Apply locations Singapore | Full time | Posted Today | Job Requisition ID: R We are seeking a Process Engineer in preparation for the formation of the joint venture between NXP and VIS, known as VSMC.
Job Description
This posting is for a Principal Etch Process Engineer in a high-volume, 300mm wafer manufacturing environment. The Senior Deep Trench Etch Engineer is responsible for optimizing and sustaining deep trench etch processes used in advanced semiconductor device fabrication. The role involves working with plasma etch tools to drive process improvements and collaborating with cross-functional teams to ensure high yield, reliability, and manufacturability of deep trench structures.
Primary Responsibilities:
Develop and optimize deep trench etch processes for silicon and compound semiconductor substrates. Characterize etch profiles, selectivity, and uniformity using SEM, profilometry, and other metrology tools.
Maintain, upgrade, and monitor wafer fabrication equipment in the Etch process area. Troubleshoot process issues and implement corrective actions to improve yield and reduce defects.
Collaborate with integration, device, manufacturing, maintenance, and process teams to improve overall etch performance.
Lead DOE (Design of Experiments) and SPC (Statistical Process Control) initiatives for process stability.
Monitor statistical process control for high-volume manufacturing equipment.
Participate in and/or lead cross-functional and lean activity teams.
Reduce defectivity mechanisms and improve process control.
Work with minimal supervision, balancing competing priorities to serve the needs of the engineering and manufacturing communities.
Drive equipment performance to maximize capacity and yield.
Improve cost performance of equipment.
Mentor engineers and provide technical leadership in etch process improvement.
Required Skills/Experience:
B.S. Degree in Electrical Engineering, Materials Science, Solid State Physics, or other relevant engineering discipline.
Minimum 15 years of semiconductor etch process engineering experience.
Experience in Lean Manufacturing is a plus.
Knowledge of semiconductor manufacturing is a plus.
Ability to handle multiple issues and shifting priorities.
Strong verbal and written communication skills.
Ability to interact with multiple disciplines in a 7x24 manufacturing facility.
Good problem-solving skills.
Self-motivated and able to take initiative.
Excellent interpersonal skills.
Competency in troubleshooting problems.
More information about NXP in Singapore...
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