Director of Advanced Packaging Process Engineering

7 days ago


Singapore ASM Full time

A leading semiconductor company in Singapore seeks a Director of Process Engineering to lead advanced packaging efforts. The ideal candidate will have at least 15 years of semiconductor process development experience and expertise in hybrid bonding and CoWoS. Responsibilities include defining process technology roadmaps, leading cross-functional teams, and managing process budgets. This role is full-time and offers an opportunity to work on cutting-edge semiconductor technologies. #J-18808-Ljbffr



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