Staff Engineer/Principal Engineer, R&D

6 days ago

Singapore STATS ChipPAC Pte. Ltd. (Corporate Office) Full time

STATSChipPac is seeking a hardworking and passionate R&D Staff Engineer/Principal Engineer, with experience in Silicon Photonics advanced packaging, to realize next-generation optical interconnects for high-volume manufacturing. The candidate will join the Singapore R&D team and lead the packaging technologies development with universities and research institutes. The candidate will drive and bring Si photonics/chiplet packaging and co-package optics development, utilizing advanced packaging technologies, to scalable production. The development covers high efficient optical I/O module architecture, assembly, optical coupling design, materials and process for fiber packaging. The candidate will report to the Vice President of R&D. The successful candidate will have demonstrated advanced packaging technologies expertise, program management, excellent communication skills, and ability to apply process-control and problem-solving methodologies to achieve business objectives. Responsibilities Responsible to lead packaging technology development and projects with universities/research institutes. Collaborate with cross-functional teams to enable scalable, manufacturable designs – define assembly baseline processes, decide package BOM, establish design/manufacturing (eg. optical coupling) that are optimized for performance, reliability, yield and cost. Work with customers, vendors and research institutes to bring packaging solution from concept to HVM. Research and create new technologies for emerging frontiers. Drive new technologies development for timely new product introduction and ramping of new technologies. Support project management and technical findings documentation through reports, reviews, or relevant forum presentations. Qualifications Strong theoretical background in optics and photonics fundamentals, device/module integration. Hands‐on experience in packaging and measuring fiber‐coupled devices, preferably has hands‐on experience in optical component design, simulation and qualification, and fiber assembly. M.S. or Ph.D. in Physics (Optics major), Material Science, Mechanical, Chemical or Electrical Engineering or related field. Minimum of 10 years of experience in semiconductor industry, including at least 5 years of experience in technical and/or project management. Familiar with wafer‐level processing and packaging (such as CMP, TSV, CoW, advanced singulation) and interconnection assembly (such as hybrid bonding, CoWoS, CoPoS). Experience in designing test vehicle for reliability and performance assessment. Capable to troubleshoot and analyze the physics of failure. Strong cross‐functional teamwork, collaboration, interpersonal, written and business skills. Good communication skills. #J-18808-Ljbffr

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