Senior Thin Film PECVD Process Engineer

Company : RF360 Singapore Pte., Ltd. Job Area : Engineering Group, Engineering Group > Hardware Engineering General Summary : As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital / Analog / RF / optical systems, equipment and packaging, test systems, FPGA, and / or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications : Bachelor's degree in Computer Science, Electrical / Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical / Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical / Electronics Engineering, Engineering, or related field. Position Summary : We are seeking a highly experienced and driven Senior CVD Process Engineer to lead process development and optimization efforts in thin film deposition technologies. This role requires deep technical expertise, strong leadership capabilities, and a collaborative mindset to drive continuous improvement and innovation in semiconductor manufacturing. Academics : Bachelor’s or master’s in chemical engineering, Materials Science, Physics, or related field. Experience / Any Other Special / Skill attributes : Minimum 5 years of hands‑on experience in CVD or related thin film deposition processes. Strong understanding of deposition mechanisms, vacuum systems, and plasma processes. Experience with PECVD, CVD, PVD, ALD, and dry etching systems; knowledge of gap‑fill dielectric deposition and sputtering preferred. Proficient in statistical and quality tools (e.g., SPC, DOE, JMP, Minitab); familiar with cleanroom operations. Strong analytical, problem‑solving, and project management skills. Self‑driven, detail‑oriented, and able to work independently with a hands‑on approach. Proven technical competency and resilience under pressure. Effective communicator and team player with a strong sense of ownership. Job Responsibilities : Lead continuous improvement projects to enhance process efficiency and yield. Develop and optimize CVD, PECVD, PVD, ALD, and dry etching processes for thin film applications. Collaborate cross‑functionally to deliver scalable manufacturing and R&D solutions. Apply deep expertise in semiconductor thin film processes to resolve technical challenges. Champion process development and equipment start‑up through structured engineering experiments. Conduct root cause analysis and implement effective corrective actions. Utilize statistical tools (SPC, DOE, JMP, Minitab) for data analysis and process control. Ensure compliance with cleanroom, safety, and quality standards. Lead task forces for short- and long‑term process improvements. Demonstrate ownership, accountability, and a proactive, hands‑on approach. Mentor junior engineers and foster technical knowledge sharing. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application / hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail or call Qualcomm's toll-free number found . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. 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