Senior Engineer, ThinFilm CMP Equipment

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To own, maintain and improve the following indices: Quality, Uptime and Cost.
Sustain equipment KPI and make continuous improvements to enhance the performance.
Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.
Coordinate with both process and Manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.
Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.
Manage the expenditure allocated for equipment maintenance without compromising on quality output.
Continuous improvement of equipment KPI in terms of quality, uptime and costs.
Plan and implement an effective Preventive Maintenance program on equipment.
Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.
Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.
Participate in CIP programs to optimize equipment utilization and cost of maintenance.
Become the technical Expert for the respective machine specialization.
Know how to use SPACE to monitor and analyze SPC charts. Know how to use JMP to analyze engineering
experiments. Know how to use measurement instruments effectively in data collection.
Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool
weaknesses and derive the top 3 to 5 risk factors.
Able to create PROMIS (SiView) DC OP and SPC charts.
Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of
equipment for production.
Wafer scrap reduction awareness and mindset.
Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance
to Junior Engineers.
Self audit and update specifications to meet TS16949 Quality Standard requirements.
Set Expectation and carry out performance appraisal for Technician or AE as instructed by
Section Manager.
Requirements:
Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
Min 3 years of relevant work experience in Thin Film CMP Equipment.
An excellent team player with good interpersonal, communication and written skills
Strong logical thinking capability and good analytical skill
High level of integrity with strong leadership attributes to lead and coach a team
Highly committed with good ownership and accountability
Able to adapt in a fast pace environment and work under pressure
Proficient in MS Office Applications
Seniority level
Seniority level Mid-Senior level
Employment type
Employment type Full-time
Job function
Industries Semiconductor Manufacturing
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