Packaging Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE The Power Integrity and Signal Integrity engineering team ensures the performance of the product are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimizationTHE PERSON As a member of the Singapore Signal Integrity team, you will be responsible for the electrical design and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector, and board. You will be required to communicate effectively and work in close collaboration with others in AMD as well as with AMD's customers to ensure optimal engineering design decisions and efficient problem solving. KEY RESPONSIBILITIES Perform electrical design and analysis for high-speed signaling and power delivery networks across silicon, package, and board levels. Develop and validate SI/PI models using industry-standard EDA tools (e.g., Cadence, Ansys HFSS, SIwave, ADS). Conduct simulations and interpret s-parameter data to ensure compliance with performance and reliability targets. Collaborate with cross-functional teams and customers to resolve design challenges and optimize system-level performance. Support characterization and measurement activities using tools such as VNA, TDR, and high-speed oscilloscopes. Drive design improvements through test board development, fixture design, and de-embedding methodologies. Document findings, provide technical guidance, and contribute to best practices for SI/PI design and analysis. Participate in forward-looking technology development, including silicon interposer and optical interconnect simulations. PREFERRED EXPERIENCE Experience in packaging, connector, and board design for power & signal integrity. Experience in electrical modeling EDA tools such as Cadence, Ansys HFSS, SIwave, ADS, etc. Experience in high-speed digital signaling interfaces such as PCIE, USB, GDDR, and DDR. Experience in SI/PI simulation and processing of s-parameters. Knowledge in silicon interposer and optical interconnects simulations. Knowledge in analog characterization, electromagnetic theory, and digital circuit analysis. Experience in test board design, fixtures, and de-embedding methodologies is a plus. Experience in measurement tools VNA, TDR, and high speed oscilloscope is a plus. Skills in developing and mentoring team members is another plus. Ability to collaborate and work across different functional teams and different sites. Self-driven and can work independently. ACADEMIC CREDENTIALS Master's degree in Electrical or Microwave Engineering is preferred. LOCATION Singapore BENEFITS AMD benefits at a glance. EEO STATEMENT AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process. #J-18808-Ljbffr