SENIOR EQUIPMENT ENGINEER

4 days ago

Singapore Micron Technology Full time

Join Micron Technology as a SENIOR EQUIPMENT ENGINEER Our vision is to transform how the world uses information to enrich life for all. We are an inclusive team passionate about using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. As an Equipment Engineer, you will be working with a team of engineers responsible for equipment start-up, development, and optimization, product yield, quality, and reliability improvements, cost reduction, cycle-time & productivity improvements, risk management, solving sophisticated manufacturing line issues, and engineering operations. Responsibilities And Tasks Lead and manage equipment-related activities in HBM production lines, including installation, qualification, troubleshooting, and maintenance. Drive continuous improvements in equipment performance, uptime, and process capability to meet production targets. Work closely with cross-functional teams to support new product introductions and process changes related to HBM. Establish and optimize equipment parameters and procedures for HBM manufacturing, ensuring compliance with quality and safety standards. Lead root cause analysis and corrective actions on equipment-related issues. Evaluate and recommend new tools, technologies, and upgrades to enhance HBM equipment capabilities. Train and mentor junior engineers and technicians on best practices and standard operating procedures. Generate and maintain accurate equipment documentation and preventive maintenance plans. Participate in capacity planning and equipment layout for HBM expansion projects. Requirements Higher Diploma with more than 15 years of relevant semiconductor experience or Bachelors with more than 10 years of relevant semiconductor experience. Minimum of 5 years of hands-on semiconductor equipment engineering experience, preferably on semiconductor packaging process including assembly, bumping, and/or RDL process. Strong understanding of HBM-related equipment, preferably in the area of thermo-compressive bonding, wafer clean, grind and trim, wafer molding, wafer mount, TnR. Worked on process/equipment development with fundamental understanding to execute to improve maturity for HBM related equipment. Problem-solving mindset with a drive for finding effective solutions. Understanding of statistical process control and process development with structured DOE. Micron Technology is an industry leader in innovative memory and storage solutions. We deliver a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. #J-18808-Ljbffr

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