Semicon R&D Process Engineer

5 days ago


Singapore People Profilers Full time

Role Overview Lead and develop wafer-level molding and related processes. Focus is on process development, optimization, stabilization, and supporting transition to mass production. Key Responsibilities Develop and optimize wafer-level molding and debonding processes for advanced packaging (2.5D, fan-out, SiP). Conduct DOE (Design of Experiments), data analysis (e.g., using JMP), and continuous process improvement. Qualify new materials, tools, and equipment for packaging and device integration. Validate processes pre-production and stabilize yield. Support customer programs with technical solutions and troubleshooting. Review and improve FMEA, OCAP, and control plans. Enhance molding, debond, and wafer resizing processes. Drive process yield and quality improvements. Support technical innovation in alignment with global customer needs. Requirements Bachelor's degree in Mechanical, Materials, or Electronics Engineering. At least 3 years' hands-on experience in wafer-level molding process engineering. In-depth knowledge of molding machines, materials, procedures, and quality standards. Familiarity with advanced packaging (2.5D, fan-out, flip-chip) and related processes (debonding, warpage, resizing). Application Process Please stating 3) Date Available 4) Reason to Leave each job: Notes We regret that only shortlisted candidates will be notified. #J-18808-Ljbffr


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