Senior Engineer – Thermo-Mechanical Simulation

4 days ago


Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

Position title : Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $4000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Angel) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered. Overview We are seeking an engineer to join our advanced semiconductor packaging team. The candidate should specialize in thermo-mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding . This role will involve close collaboration with cross-functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next-generation semiconductor products. Key Responsibilities Thermo-Mechanical Simulation & Modelling Develop and execute detailed finite element (FEA) models to predict package warpage during assembly, reflow, and operation.Perform thermo-mechanical stress and strain analysis to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers).Model and analyze thermal flow and heat distribution within the package during Thermocompression bonding and other thermal processes. Thermal Flow & Process Interaction Simulate and optimize thermal



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