Head of TCB Process Engineering — Bonding Innovation

7 days ago

Singapore Pyxis CF Full time

A semiconductor packaging technology firm based in Singapore is seeking a Head of Process Engineering. The role involves leading the development and qualification of bonding processes for advanced semiconductor packaging. Candidates should have over 8 years of experience in TCB or Hybrid Bonding, strong leadership skills, and a relevant degree. Competitive compensation includes bonuses and equity participation.#J-18808-Ljbffr

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