Senior / Engineer - Yield & Process Integration

2 days ago

Singapore UTAC Full time

Overview
Senior / Engineer – Yield & Process Integration. Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).
Responsibilities
Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).
Analyze data for yield and detect trends.
Execute CIP (Continuous Improvement Program) or project activities that contribute to yield and cost-efficiency improvements.
Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability.
Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production.
Act as the overall coordinator of customer-initiated BKM exercises.
Requirements
Degree in Engineering
Minimum 3 years of relevant experience, preferably in the semiconductor industry
Familiar with SPC, APQP, and data analysis tools
Strong problem-solving and analytical skills
Seniority level
Executive
Employment type
Full-time
Job function
Engineering and Manufacturing
Industries
Semiconductor Manufacturing
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