HBM Field Applications Engineer

3 days ago

Singapore Micron Semiconductors Full time

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities High Bandwidth Memory (HBM) Program alignment/expansion with key Micron customers, assist with Micron's HBM qualifications, and Technical Opportunity management with our HBM customer engagements Extend/grow technical relationship with key HBM customers as the local execution and critical issue point of contact Work with the Micron and customer qualification labs to complete qualification and debug any issues that arise Influence engagement strategies on HBM opportunities with key customers Work closely with Sales and Business Units to develop and complete a strategic plan & supervise progress to key objectives Work alongside customers to identify new business, discuss ongoing projects including areas of concern & future needs Assist in driving and solving technical challenges with Micron products and customer systems; be the central contact during critical issues between customer and Micron development/systems teams and work with multi-functional groups until issue resolution has been delivered to the customer Act as an advisor to our customers by providing memory architecture advice, memory product recommendations, delivering technical trainings and developing solutions. Must engage with highly technical hands-on validation team to be an interface point, and provide real-time technical expertise Qualifications Hands-on lab skills for memory (DRAM) design-in (HBM experience Preferred)Lab design and deployment experience Design, product, test, support, system, or applications engineering experience in DRAM and/or Compute system design. Direct experience with GDDR and/or HBM a plus. (at least 5 years of experience)Systems experience (HBM, Graphics Memory, interface, training/error reporting, AI platforms), sophisticated packaging/integration experience, and experience with failure analysis during NPI Ability to demonstrate problem solving and troubleshooting skills including lab testing (oscilloscope and logic analyzer usage) and debug The ability to be self‐motivated, take initiative, and to work independently or in a team environment The ability to work with engineers across multiple disciplines, as well as customers of various positions including executive level interaction Excellent PC usage skills including Microsoft Office (Excel, PowerPoint, Word). Quality and Reliability experience is a plus Excellent verbal, written, and customer communications skills Education Bachelors or Masters degree in Electrical Engineering or related discipline. #J-18808-Ljbffr

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