Optical Transceiver Design Engineer

Overview
Direct message the job poster from Ligent
Manager of Opearations at Hisense Broadband, Inc.
Position Overview
We are seeking a highly motivated Optical Transceiver Design Engineer to join our R&D team. The engineer will be responsible for the design, development, and validation of next-generation optical transceiver modules (100G/400G/800G/1.6T). This role requires strong interdisciplinary knowledge in high-speed electrical design, mechanical/thermal design, firmware development, signal/power integrity, and manufacturing process integration.
Responsibilities
Electrical Design
Design high-speed circuits for optical transceivers, including laser drivers, TIAs, CDRs, DSP interfaces, and power management circuits.
Perform schematic design, component selection, and circuit optimization for signal integrity and low jitter.
Collaborate with vendors to qualify and integrate advanced ICs (DSPs, drivers, TIAs, controllers).
Firmware & Control
Develop and validate firmware for module control, monitoring, diagnostics, and standards compliance (CMIS, IEEE, MSA).
Implement control algorithms for laser, TEC, and power management subsystems.
Conduct firmware debugging, system integration, and regression testing.
Simulation (SI/PI/EMI)
Perform Signal Integrity (SI) and Power Integrity (PI) simulations to ensure compliance with IEEE/ODCC/OIF standards.
Analyze high-speed channels, PCB traces, connectors, and package effects.
Evaluate EMI/EMC performance and propose design optimizations.
PCB Design
Define PCB stack-up, routing rules, and layout guidelines for high-speed differential signals (25G/50G/100G per lane).
Collaborate with PCB layout engineers to achieve optimal routing for high-speed and power delivery.
Perform layout reviews and ensure compliance with DFM/DFT standards.
Mechanical / Thermal Design
Support thermal modeling, heat sink design, and system-level cooling strategies.
Ensure compliance with MSA mechanical specifications and customer requirements.
Process Development & Manufacturing
Work with manufacturing teams to define assembly processes (SMT, wire bonding, fiber attach, optical alignment).
Optimize module assembly yield, reliability, and manufacturability.
Support NPI (New Product Introduction) from prototype to mass production.
Test & Validation
Define test plans and validation procedures for optical/electrical/firmware functions.
Conduct compliance testing for IEEE, OIF, MSA, and customer requirements.
Perform root-cause analysis and support reliability qualification (GR-468, Telcordia).
Qualifications
Bachelor’s/Master’s degree in Electrical Engineering, Optical Engineering, Physics, Computer Engineering, or related field.
Strong background in one or more areas:
Firmware development (C/C++, embedded systems, I2C/SPI, CMIS/MSA compliance)
PCB layout for high-speed differential routing
Mechanical/Thermal modeling (SolidWorks, Icepak, FloTHERM)
Hands-on experience with lab equipment: high-speed oscilloscopes, BERT, VNA, TDR, optical power meters, etc.
Knowledge of optical components (lasers, modulators, photodiodes, fiber coupling).
Strong problem-solving skills and ability to work in cross-functional teams.
Experience in volume manufacturing and NPI is a plus.
Preferred Experience
Experience with 400G/800G/1.6T optical module development.
Familiar with industry standards: IEEE 802.3, OIF CEI, CMIS, MSA specifications.
Familiarity with reliability testing and Telcordia standards (GR-468).
Prior experience in tier-1 optical transceiver companies is an advantage.
Seniority level
Mid-Senior level
Employment type
Full-time
Job function
Industries
Telecommunications
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