Senior 2.5D Packaging Process Engineer

Position title : Senior Engineer - Thermo-Mechanical Simulation (Semiconductor Packaging) Location: Admiralty Working Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $4000 - $8000 (depends experience)Overview We are seeking an engineer to join our advanced semiconductor packaging team. The candidate should specialize in thermo-mechanical simulation...

Responsibilities Develop photonics IC (PIC) and electronics IC (EIC) co-packaging and assembly process flow with OSAT partner.. Define PIC and EIC hybrid integration packaging design rules, process flow, and material sets. Lead optical package development to establish package manufacturability and reliability. Define PIC and EIC IO pad frame and 2.5D...

Position title : Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $4000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Angel) and allow our Consultant to match you with our Clients. No Charges will be...

MTS Integration & Yield (Advanced Packaging) page is loaded## MTS Integration & Yield (Advanced Packaging)locations: Singaporetime type: Full timeposted on: Posted Yesterdayjob requisition id: JR- **About** **GlobalFoundries**GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication...

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...

About MarvellMarvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel...

Head of Process Engineering – Thermo-Compression Bonder Systems PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor...

About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next‑generation Thermo‑Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...

About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration.Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...

**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...