R&D Process Engineer

7 days ago


Singapore People Profilers Pte Ltd Full time

Job Title: R&D Process Engineer (MOLD) Process development and characterization for R&D projects. To lead the development, optimization, and stabilization of wafer level molding and related processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer‑specific technical solutions. Responsibilities Develop wafer level molding and debond process capabilities to achieve a good quality and wafer warpage for advanced packaging technologies including 2.5D, fan‑out, and SiP. Perform DOE planning, continuous improvement, engineering evaluation and analyze experimental data using statistical tools (e.g., JMP). Qualify new materials (direct and indirect), tools, equipment on new package and device qualification. Conduct pre‑production process validation and yield stabilization. Provide technical support for customer programs. Troubleshoot quality issues. Review the FMEA, OCAP and Control Plan of new packages to achieve better yield and assembly performance prior and during low‑volume manufacturing (LVM) transition. Support fan‑in and fan‑out advanced packaging development processes in molding, debond, wafer resize. Contribute directly to process yield, quality improvement, and customer technical satisfaction. Drive technical innovation in advanced packaging technologies in alignment with global customer programs. Requirements Bachelor’s degree in Engineering (Mechanical/Materials/Electronics). 3–5 years of hands‑on experience in process engineering for wafer level molding in semiconductor manufacturing. Fundamental understanding of advanced semiconductor fabrication and integration processes. Proficiency in preparing technical documentation and delivering presentations. Knowledge in molding process: machine, materials, procedures, operations, quality requirements. Knowledge of advanced packaging technologies including 2.5D, fan‑out, and flip‑chip. Familiarity with related processes such as debond, warpage adjustment, wafer resize. Benefits All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits. How to Apply Please email your resume in a detailed MS Word format to , stating:1) Current drawn salary2) Expected salary3) Date available4) Reason to leave each job We regret that only shortlisted candidates will be notified. Contact Information People Profilers Pte Ltd20 Cecil St, #08‑09, PLUS Building, Singapore Tel: web: Legal EA License Number: 02C4944EA Personnel Reg nos R #J-18808-Ljbffr


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