Laser-Assisted Bonder

Laser-Assisted Bonder (LAB) Process Engineer Location: Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding. Key Responsibilities Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput. Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams. Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products. Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams. Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA). Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology