Process Innovation Lead

3 days ago


Singapore beBeeEngineering Full time $90,000 - $120,000
Job Title: Bumping Process Manager

Overview:
Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation. Drive technical and operational excellence through collaboration with cross-functional teams.

Responsibilities:
• Provide leadership and strategic direction for the bumping engineering team
• Oversee development, optimization, and qualification of 300mm bumping processes
• Execute technology roadmap and stay ahead of industry trends
• Collaborate with manufacturing, quality, equipment engineering, and R&D teams
• Foster innovation and continuous process improvement
• Identify and mitigate process risks to ensure production quality

Requirements:
Bachelor's in Engineering, Physics, Materials Science, or related field
10-12+ years experience in bumping engineering or 300mm wafer processing

Ideal Candidate:
Proactive leader with strong technical skills and ability to drive innovation

Referral Scheme:
Refer a qualified candidate and receive SGD1,000 or SGD350 in shopping vouchers

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