CMOS Reliability Expert for Next-Generation Memory

5 days ago

Singapore Micron Full time
Transforming Information to Enrich Life

Micron is committed to revolutionizing how the world utilizes information to enhance life for everyone. As a Senior DDQA CMOS Reliability Engineer, you will be at the forefront of this transformation.

About the Role

We are seeking a highly skilled expert in CMOS reliability to develop and optimize quality and reliability criteria related to CMOS process for the next generation of Micron's memory parts. You will partner with Technology Development (TD) on the latest products and technologies related to CMOS Front end/interconnect module and define quality and reliability fail modes, especially NUDD, to mitigate risk and achieve product qualification milestones successfully.

Responsibilities
  • Drive new CMOS devices or modules for future technology from Product Quality and Reliability perspective.
  • Define and implement Reliability test methodology for validating the risk of new CMOS module for the next generation of Micron's memory parts.
  • Provide insights and guidance to the Global Quality (GQ) management team on topics involving CMOS.
  • Interact and collaborate with Design Team, TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
  • Develop/re-define inline and electrical critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
  • Characterize and validate new CMOS device, models, and test structures for developing future NAND products.
  • Develop, establish new CMOS Param or optimize scribe design for CMOS parameters.
  • Collaborate with various stakeholders and provide DDQA independent assessment on Quality & Reliability items in various technology development milestones (EPP, SVC, MSC, VME), escalate issues and collaborate for timely risk mitigation and resources, also provide inputs for Leaderships in making decision on passing the Qual milestone (Low Tier Qual/High Tier Qual/Auto Qual etc).
  • Support technology transfer to production facilities (some international travel may be required).
  • Partner with multiple stakeholders in Process Conversion Review Board Meeting (PCRB) to improve coverage from various aspects of product quality and reliability and prevent post qual escapes or excursion triggered by conversion.
  • Identify gaps and drive initiatives/programs/business process to build margin around structural, electrical, and reliability performance.
  • Build Product Fail Modes Repository based on NUDD (proactive) and previous issues (reactive), and work with key stakeholder to prevent issues or implement effective detections controls and containment.
Requirements
  • 4+ years' experience in semiconductor related engineering, preferably in 300mm wafer fab.
  • Hands-on experience on advanced CMOS engineering and reliability, specialized in Microelectronics and Semiconductor Device Physics is a requirement.
  • Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
  • Understanding of Reliability items for CMOS and Array
  • Understanding of electrical specifications, Probe and Param registers
  • Knowledge of 3D NAND Fab processes, flow and common reliability and yield fail modes is preferred.
  • Highly skilled at problem-solving activity and capability of leading cross-functional team.
  • Understanding on technical risk assessment, FMEA, and 8D methodology for root cause analysis and problem solving.
  • Effective verbal and written communication skills in English.
  • Good multitasking skills and ability to set priorities in a fast-moving, dynamic environment.
  • Ability to work independently, with minimal direction, and a focus on meeting commitments.
  • Real passion for improving product quality to increase customer satisfaction.
Estimated Salary: $150,000 - $200,000 per annum

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