Principal R&D Engineer
6 hours ago
At TE Connectivity, we're committed to creating a safer, more sustainable, and connected world. As a Principal R&D/Product Development Engineer, you'll be part of a dynamic team that conceives original ideas for new products and introduces them into practice.
Job Responsibilities:- Develop and implement signal integrity design performance/functional requirements for new products.
- Perform signal integrity simulations for multiple high-speed standards on each product.
- Drive product development for business success.
- Engage in innovative simulation and test tool improvement and process enhancement.
- Drive best practices and efficiency in connector design and component qualifications from a signal integrity standpoint.
- Mentor and teach other engineers across disciplines/BUs.
- Be an expert in analyzing competitive products and driving internal & competing IP positions.
- Bachelor's degree in Electrical Engineering; Master's Degree preferred.
- Minimum of 10 years of relevant work experience in electrical Design, RF design or PCB design.
- Solid understanding of electromagnetic theory and electrical circuit behavior.
- Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools).
- Expert with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent).
- Expert with high-speed test equipment (VNA, TDR, BERT).
- Expert with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
- Expert with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces.
- Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
- Experience with physical layer communications systems and architectures.
- Fluent in English (both verbal and written).
- Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
- Expert in analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
- Learning Capability: Open minded, coachable, willing to learn new skills, and motivated to grow.
- Pro-active in identifying complex situations, providing solutions, and driving improvements to evolving procedures.
- Experience writing technical papers and presenting to BU-level organizations, external conferences, and critical customer contacts.
- Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system.
- Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems).
- Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English.
- Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.
- Six Sigma methodologies or other strong data analytics background.
- Printed circuit board design, fabrication and assembly (Altium, AutoCAD).
- Experience in project leadership, especially as it applies across design, development & manufacturing teams.
- Test equipment (oscilloscope, vector network analyzer, BERT).
- Signal conditioning techniques (equalization, amplification).
- Direct customer design and support experience.
- Application and test knowledge of high-speed devices and equalization techniques.
Values: Integrity, Accountability, Inclusion, Innovation, Teamwork
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