Technical Packaging Specialist

4 days ago

Singapore beBeeSemiconductor Full time $80,000 - $150,000
Job Description

The primary responsibility of this role is to ensure the quality and conformance of materials in a semiconductor manufacturing environment.

Key Responsibilities:

  • Lead teams of engineers and inspectors in performing yield and product gating checks, driving performance improvement, and aligning with production goals.
  • Responsible for backend semiconductor packaging processes including ball drop, bumping, singulation, backgrind, and mounting.
  • Develop or enhance procedures and work instructions related to backend PQC processes.
  • Provide engineering support to meet targets for output, product quality, efficiency, yield, cycle time, and safety.
  • Perform data analysis using statistical tools, summarize findings, and present results to relevant stakeholders.
  • Drive and facilitate meetings to mitigate yield loss, create action roadmaps, and implement continuous improvement strategies with cross-functional teams.
  • Identify chronic process and quality issues and implement permanent corrective actions.
  • Collaborate with OSAT process/integration teams to resolve process-related defects impacting yield and product quality.
  • Ensure audit readiness for internal and external audits and manage timely closure of findings.

Requirements:

  • Bachelor's Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or a related field).
  • Minimum 5 years of relevant experience in backend semiconductor packaging processes and quality control.
  • Strong foundation in process engineering, yield improvement, and quality control.
  • Proficient in SPC and data analysis tools.
  • Familiarity with FMEA, Control Plans, and OSAT backend processes.
  • Hands-on experience with new product and process evaluations.
  • Effective communicator; capable of presenting data and driving cross-team collaboration.
  • Able to thrive in a fast-paced, high-volume manufacturing environment.

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