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Process Development Engineer

3 weeks ago

Singapore beBeeLithography Full time $120,000 - $180,000
Senior Process Engineer

GlobalFoundries is a leading full-service semiconductor foundry. We provide a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies.

As a Senior Process Engineer, you will lead Litho module UMD process engineers to develop advanced packaging processes. You will ensure new process qualification lots operate smoothly and report key milestones to the Head of Department to ensure project timelines are met.

You will work with equipment teams to improve process robustness, troubleshoot issues that arise during process setup, and establish new requirements based on process needs.

Additionally, you will collaborate with integration teams to improve process stability and margin, achieve good quality processes, and cost-effective production.

Excellent communication skills are required to interact with customers effectively. You will also organize and provide training for engineers and AEs to transfer process knowledge before running mass production.

Relevant experience in TSV etch, plasma dicing etch, and bonding fabrication etch is essential. A Bachelor's degree in Electrical Engineering, Chemical Engineering, Physics, or relevant physical science discipline is required.

Preferred qualifications include a Master's degree in Electrical/Electronics/Mechanical/Chemical Engineering or Honors Degree in Physics/Chemistry. More than 10 years of relevant experience, including at least 3 years in advanced packaging, is desired.

Strong interpersonal skills and ability to work effectively with different cultures are necessary. GlobalFoundries is an equal opportunity employer and welcomes diversity in the workplace.

  • Key Responsibilities:
  • Lead Litho module UMD process engineers to develop advanced packaging processes.
  • Ensure new process qualification lots operate smoothly.
  • Report key milestones to the Head of Department.
  • Work with equipment teams to improve process robustness.
  • Troubleshoot issues that arise during process setup.
  • Establish new requirements based on process needs.
  • Collaborate with integration teams to improve process stability and margin.
  • Achieve good quality processes and cost-effective production.
  • Organize and provide training for engineers and AEs.
Required Qualifications:
  • Bachelor's degree in Electrical Engineering, Chemical Engineering, Physics, or relevant physical science discipline.
  • Relevant experience in TSV etch, plasma dicing etch, and bonding fabrication etch.
Preferred Qualifications:
  • Master's degree in Electrical/Electronics/Mechanical/Chemical Engineering or Honors Degree in Physics/Chemistry.
  • More than 10 years of relevant experience, including at least 3 years in advanced packaging.
  • Strong interpersonal skills and ability to work effectively with different cultures.