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Electronics Packaging Engineer

2 weeks ago

Singapore beBeePackaging Full time $60,000 - $100,000

We are seeking an experienced professional to support high-performance IC chip packaging and assembly for RF packages at our facility in Central-North region, Singapore.

Key Responsibilities:
  • Operate and maintain assembly equipment for epoxy dispensing, die attach, wire bonding, plasma cleaning, curing, pull/shear testing, leak testing, etc.
  • Develop Design of Experiments (DOEs) to improve assembly processes.
  • Assist in the development of producible designs.
  • Create process instructions and method sheets.
  • Determine tooling/fixturing requirements and support assembly design.
  • Troubleshoot equipment and process issues.
  • Research and procure special tooling/equipment.
  • Communicate progress to management and teams.
  • Perform IC chip assembly per work instructions, drawings, and specifications.
  • Maintain quality standards during production.
Requirements:
  • Diploma/ITE in Electronics or any engineering-related discipline.
  • Minimum 5 years of experience in IC assembly operations.
  • Hands-on experience in epoxy dispensing, die attach, and wire bonding (thermo-compression bonding), including equipment setup, operation, and troubleshooting.
  • Able to work with incomplete information and explore new IC packaging processes.
  • Strong analytical and diagnostic skills for process and equipment issues.
  • Experience with RF/Microwave assemblies for high-reliability environments.
  • Ability to work overtime or weekends as needed.
Benefits:

This role offers opportunities for growth and development in a dynamic environment. The successful candidate will have the opportunity to work on challenging projects and contribute to the success of the team.

Work Environment:

The work environment is fast-paced and dynamic, with a focus on delivering high-quality results. The ideal candidate will be able to work effectively in a team environment and communicate clearly with colleagues and management.